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Mentor荣获双项台积电OIP年度合作伙伴奖

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<p><span><span lang="EN-US">Mentor, a Siemens business<a><span>&nbsp;</span></a></span></span><span><span><span>近日凭借其领先的</span></span></span><span><span><span lang="EN-US"><span>&nbsp;</span>EDA<span>&nbsp;</span></span></span></span><span><span><span>解决方案被台积电（</span></span></span><span><span><span lang="EN-US">TSMC</span></span></span><span><span><span>）</span></span></span><span><span><span><span>&nbsp;</span></span></span></span><span><span><span>授予两项</span></span></span><span><span><span lang="EN-US">2020</span></span></span><span><span><span>年度</span></span></span><span><span><span lang="EN-US">OIP</span></span></span><span><span><span>合作伙伴奖</span></span></span><span><span>。该奖项面向</span></span><span><span lang="EN-US"><span>&nbsp;</span>Mentor<span>&nbsp;</span></span></span><span><span>等台积电开放式创新平台</span></span><span><span lang="EN-US"><span>&nbsp;</span>(OIP)<span>&nbsp;</span></span></span><span><span>生态系统的合作伙伴，旨在表彰其过去一年中在下一代系统级芯片</span></span><span><span lang="EN-US"><span>&nbsp;</span>(SoC)<span>&nbsp;</span></span></span><span><span>和</span></span><span><span lang="EN-US"><span>&nbsp;</span>3DIC<span>&nbsp;</span></span></span><span><span>设计支持方面所做出的杰出贡献。</span></span></p>

<p><span>获得台积电</span><span lang="EN-US">OIP<span>&nbsp;</span></span><span>年度合作伙伴奖项的公司在设计、开发和技术实施方面均达到了最高标准，全面助力芯片创新。此次</span><span lang="EN-US">Mentor</span><span>获奖的两个类别分别为<a>“联合开发</a></span><span><span lang="EN-US">3DIC<span>&nbsp;</span></span></span><span><span>设计生产力解决方案”和“联合开发</span></span><span><span lang="EN-US">3nm<span>&nbsp;</span></span></span><span><span>设计基础架构”</span></span><span>。在此基础之上，</span><span lang="EN-US">Mentor<span>&nbsp;</span></span><span>将进一步与台积电深入合作，通过支持台积电最新技术认证的解决方案来实现下一代</span><span lang="EN-US"><span>&nbsp;</span>SoC<span>&nbsp;</span></span><span>和</span><span lang="EN-US"><span>&nbsp;</span>3DIC<span>&nbsp;</span></span><span>设计。</span></p>

<p><span lang="EN-US">TSMC<span>&nbsp;</span></span><span>设计基础架构管理部高级总监</span><span lang="EN-US"><span>&nbsp;</span>Suk Lee<span>&nbsp;</span></span><span>表示：“很高兴</span><span lang="EN-US">Mentor<span><span>&nbsp;</span></span></span><span>及其</span><span lang="EN-US">EDA<span>&nbsp;</span></span><span>解决方案能够在两大类别中赢得本年度的台积电</span><span lang="EN-US">OIP</span><span>合作伙伴奖。这是对于台积电和</span><span lang="EN-US">Mentor</span><span>长期合作成果的一种肯定，表明我们正携手克服客户所面临的设计挑战，并针对智能手机、</span><span lang="EN-US">HPC</span><span>（高性能计算）、汽车、人工智慧</span><span lang="EN-US">/</span><span>机器学习和物联网应用等领域不断扩展新的设计平台。”</span></p>

<p><span>此次</span><span lang="EN-US">Mentor</span><span>能够在</span><span lang="EN-US">3DIC<span>&nbsp;</span></span><span>设计生产解决方案方面获得认可，是由于其</span><span lang="EN-US">Xpedition<span>&nbsp;</span></span><span>软件平台为台积电的</span><span lang="EN-US"><span>&nbsp;</span>2.5/3D<span>&nbsp;</span></span><span>制程提供了广泛支持，其中包括用于设计规划和网表的</span><span lang="EN-US"><span>&nbsp;</span>Xpedition Substrate Integrator</span><span>，以及用于基板布局的</span><span><span>&nbsp;</span><span lang="EN-US">Xpedition Package Designer</span></span><span>，经过增强后的</span><span lang="EN-US">Xpedition Package Designer</span><span>也已经满足台积电最新的</span><span lang="EN-US"><span>&nbsp;</span>InFO<span>&nbsp;</span></span><span>技术要求。随着设计复杂性的逐渐增加，客户对于分析能力的需求也在不断提升，</span><span lang="EN-US">Mentor Calibre®</span><span>物理验证平台中的</span><span lang="EN-US">3DSTACK</span><span>技术为了满足最新的</span><span lang="EN-US">CoWoS®<span>&nbsp;</span></span><span>需求，也扩充了电晶粒内</span><span lang="EN-US">(</span><span lang="EN-US">inter-die</span><span lang="EN-US">)<span>&nbsp;</span></span><span>端口连接检测。</span></p>

<p><span>此外，</span><span lang="EN-US"><span>&nbsp;</span>Mentor<span>&nbsp;</span></span><span>的</span><span lang="EN-US">Analog FastSPICE<span>&nbsp;</span></span><span>平台和</span><span lang="EN-US">Calibre® nmPlatform</span><span>验证平台也已经获得台积电最新的</span><span lang="EN-US">3</span><span>纳米技术认证。</span><span lang="EN-US">Analog FastSPICE<span>&nbsp;</span></span><span>平台可为纳米级模拟、射频</span><span lang="EN-US"><span>&nbsp;</span>(RF)</span><span>、混合信号、存储器和定制数字电路提供先进的电路验。</span></p>

<p><span lang="EN-US">Mentor Calibre<span>&nbsp;</span></span><span>设计解决方案产品管理副总裁</span><span lang="EN-US"><span>&nbsp;</span>Michael Buehler-Garcia<span>&nbsp;</span></span><span>表示：“我们非常荣幸能够再次获得台积电的</span><span lang="EN-US"><span>&nbsp;</span>OIP<span>&nbsp;</span></span><span>年度合作伙伴奖项。未来，我们的共同客户将会面对更加复杂的设计难题，而台积电和</span><span lang="EN-US">Mentor<span>&nbsp;</span></span><span>也将继续携手，为客户提供行业领先的解决方案，帮助他们将这些复杂设计变为现实。”</span></p>

<p>Mentor Graphics Corporation是西门子旗下业务，拥有世界领先的电子硬件和软件设计解决方案，致力于为全球最成功的电子、半导体和系统企业提供产品、咨询服务以及优质支持。公司总部位于俄勒冈州。更多详情敬请访问：<a href="http://www.mentor.com/">http://www.mentor.com</a></p&gt;