<p><span>32</span><span>及</span><span>64</span><span>位高效能、低功耗</span><span>RISC-V CPU</span><span>处理器核心领导供货商、</span><span>RISC-V</span><span>基金会创始首席会员晶心科技(</span><span>TWSE: 6533</span><span>),宣布全球业界</span><span>首款</span><span>RISC-V</span><span>向量处理器核心</span><span>AndesCore™ NX27V</span><span>升级支持最新</span><span>RISC-V</span><span>向量(</span><span>RVV</span><span>)扩展指令</span><span>1.0</span><span>版以及支持更多的配置以满足不同市场的需求。</span><span>RVV 1.0</span><span>新增的指令包括数学计算的</span><span>向量浮点倒数(</span><span>vector floating-point reciprocal</span><span>)及平方根倒数估计(</span><span>reciprocal square-root estimate</span><span>)</span><span>。并且除了原有的缓存器分组之外,</span><span>LMUL</span><span>(</span><span>vector length multiplier</span><span>)新增的分数选项使用较少的缓存器位,在使用上更有弹性。</span><span>NX27V</span><span>具备强大的向量运算和平行运算能力,特别适合大量数据运算的应用,例如人工智能(</span><span>AI</span><span>)、</span><span>AR/VR</span><span>、计算机视觉、加密和多媒体等等。</span></p>
<p><span>NX27V</span><span>是与</span><span>Cray</span><span>超级计算机架构类似的向量运算引擎,每个向量缓存器最大可以选定为</span><span>512</span><span>位宽,并可经由软件设定扩充至</span><span>4,096</span><span>位。</span><span>NX27V</span><span>支持包括整数、定点和浮点的</span><span>RVV</span><span>标准数据类型,同时也支持晶心针对</span><span>AI</span><span>所优化的</span><span>BFloat16</span><span>及</span><span>4</span><span>位数据类型。</span><span>NX27V</span><span>包含纯量(</span><span>Scalar</span><span>)单元和乱序执行(</span><span>Out-of-Order</span><span>)向量处理单元(</span><span>VPU</span><span>)。乱序执行向量处理单元具有多个功能单元,每个功能单元可同时处理高达</span><span>512</span><span>位的数据,支持多样化应用的运算需求。</span><span>NX27V</span><span>具备标准的开发工具、</span><span>RVV</span><span>运算库以及强大的可视化分析工具</span><span>AndesClarity™</span><span>,能协助分析并且优化关键运算核心的效能。此外,在使用多个</span><span>NX27V</span><span>的情况下,具备整合</span><span>LLVM</span><span>编译程序的</span><span>OpenCL™</span><span>可在异构计算(</span><span>heterogeneous computing</span><span>)架构上执行并行计算。透过</span><span>512</span><span>位</span><span>VLEN<span> </span></span><span>和</span><span>256</span><span>位</span><span>SIMD</span><span>宽度的配置,</span><span>NX27V</span><span>能在</span><span>MobileNet v1</span><span>卷积神经网络(</span><span>CNN</span><span>)实现超过</span><span>66</span><span>倍加速的效果。</span></p>
<p><span>串流通讯端口</span><span>(Streaming Port)</span><span>是</span><span>NX27V</span><span>基于</span><span>ACE</span><span>(</span><span>Andes Custom Extension™</span><span>)框架的独特功能,专用的接口让</span><span>NX27V</span><span>缓存器和外部组件以高效率的方式交换大量数据,无论是简单的智能区域内存或是全功能具备</span><span>DMA</span><span>的协同处理器等皆适用。串流通讯端口具备解耦</span><span>(decoupled)</span><span>指令及具有高效率握手协议</span><span>(handshaking)</span><span>的数据信道。举例来说,</span><span>ACE</span><span>的向量加载</span><span>/</span><span>储存</span><span>(Load/Store)</span><span>指令可设计为每个周期将控制信息发送至命令信道(</span><span>command channel</span><span>),让新的向量数据透过数据信道传送,并同时更新地址。如同</span><span>RVV</span><span>加载</span><span>/</span><span>储存指令,他们也能辨识包括</span><span>LMUL</span><span>等的</span><span>RVV</span><span>标准设置。</span><span>ACE</span><span>加载</span><span>/</span><span>储存指令注重数据的相依性,</span><span>因为</span><span>NX27V</span><span>缓存器采用记分板(</span><span>scoreboard</span><span>)技术。</span><span>藉由强大的串流通讯端口,</span><span>NX27V</span><span>能与硬件引擎</span><span>相辅相成,</span><span>充分发挥专属功能的效能,同时利用周全且具有弹性的</span><span>RVV</span><span>扩充指令来提升整体的效能。</span></p>
<p><span>「</span><span>NX27V</span><span>已获多家服务器领域的客户采用。在这次的新版本中,</span><span>NX27V</span><span>升级为符合最新</span><span>RVV</span><span>规格以及最高支持到</span><span>64</span><span>位</span><span>FP64</span><span>和</span><span>Int64</span><span>的所有数据类型。</span><span>NX27V</span><span>新增</span><span>256</span><span>位</span><span>VLEN</span><span>和</span><span>SIMD</span><span>的配置,以满足多样的性能及面积需求,」晶心科技总经理暨技术长苏泓萌表示。「结合完整的软件开发环境、计算库及</span><span>AI</span><span>编译程序的支持,</span><span>NX27V</span><span>能实现从边缘运算至云端运算的高传输率应用。」</span></p>
<p><span>「我很荣幸宣布</span><span>NX27V</span><span>获颁</span><span>2020</span><span>年度</span><span>ASPENCORE</span><span>全球电子成就奖(</span><span>WEAA</span><span>)的『年度杰出产品表现奖』以及在新竹科学园区四十周年庆时获得『新竹科学园区优良厂商创新产品奖』,」晶心科技执行长林志明表示,「我认为</span><span>NX27V</span><span>是市场上最佳的向量处理器</span><span>IP</span><span>,而获奖更代表</span><span>NX27V</span><span>的出色性能和丰富功能获得国际性的肯定。」</span></p>
<p><span>NX27V</span><span>目前已经开放授权。更多有关晶心科技的信息,请至</span><span>http://www.andestech.com/tw/</span><span>或与晶心科技销售部门</span><span>sales@a…。</span></p>
<p><img alt="晶心科技RISC-V向量处理器NX27V升级至RVV 1.0" data-entity-type="file" data-entity-uuid="58a35278-fb98-478c-8bd6-42a0ac1c67ab" src="http://new.eetrend.com/files/2021-04/wen_zhang_/100070630-144243-1.jpg&…; /></p>
<p><strong>关于晶心科技</strong></p>
<p><span>晶心科技股份有限公司于</span><span>2005</span><span>年成立于新竹科学园区,</span><span>2017</span><span>年于台湾证交所上</span><span>市</span><span>(</span><span>TWSE: 6533</span><span>)。晶心是</span><span>RISC-V</span><span>国际协会</span><span>(</span><span>RISC-V International</span><span>)的创始首席会员,也是第一家采用</span><span>RISC-V</span><span>作为其第五代架构</span><span>AndeStar™</span><span>基础的主流</span><span>CPU</span><span>供货商。为了满足当今电子设备的苛刻要求,晶心提供了可配置性高的</span><span>32/64</span><span>位高效</span><span>CPU</span><span>核心,包含</span><span>DSP</span><span>、</span><span>FPU</span><span>、</span><span>Vector</span><span>、超纯量</span><span>(</span><span>Superscalar</span><span>)及多核心系列,可应用于各式</span><span>SoC</span><span>与应用场景。晶心并提供功能齐全的整合开发环境和全面的软</span><span>/</span><span>硬件解决方案,可帮助客户在短时间内创新其</span><span>SoC</span><span>设计。</span><span>Andes-Embedded™ SoC</span><span>的年出货量在</span><span>2020</span><span>年突破</span><span>20</span><span>亿颗,而截至</span><span>2020</span><span>年底,累积出货量已超过</span><span>70</span><span>亿颗。</span></p>
<p><strong>关于晶心</strong><strong>RISC-V AndesCore</strong><strong>™</strong><strong>系列</strong></p>
<p><span>晶心科技全面的</span><span>RISC-V CPU</span><span>系列涵盖了入门级</span><span>32</span><span>位</span><span>N22</span><span>、中阶</span><span>32</span><span>位</span><span>N25F/D25F/A25/A27/A27L2</span><span>和</span><span>64</span><span>位</span><span>NX25F/AX25/AX27/AX27L2</span><span>以及高阶多核</span><span>A(X)25MP</span><span>和向量处理器</span><span>NX27V</span><span>,以及近期推出的最新超纯量的</span><span>45</span><span>系列。</span></p>
<p><span>关于更多晶心科技的信息,欢迎参阅晶心科技官网:</span><a href="http://www.andestech.com/"><span>http://www.andestech.com/</span></a></…;