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独立半导体设备制造商ITEC借助高生产率的芯片组装系统缓解半导体短缺问题

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<p><em><span>最快速的组装和电气测试设备;利用大数据和机器学习技术的集成智能制造解决方案,实现优化的工业</span></em><em><span lang="EN-US">4.0</span></em><em><span>生产</span></em></p>

<p><span lang="EN-US">7</span><span>月</span><span lang="EN-US">6</span><span>日,荷兰奈梅亨,</span><span>由</span><span>飞利浦(现为</span><span lang="EN-US">Nexperia</span><span>)于</span><span lang="EN-US">1991</span><span>年创立的半导体设备制造商</span><span lang="EN-US">ITEC</span><span>,今日宣布成为独立实体。</span><span lang="EN-US">ITEC</span><span>仍然</span><span>是</span><span lang="EN-US">Nexperia</span><span>集团的一部分。通过此举,</span><span lang="EN-US">ITEC</span><span>能够及时解决第三方市场的问题,满足对半导体的喷井式需求。</span><span lang="EN-US">ITEC</span><span>致力为全球半导体制造商提供</span><span>经久耐用的创新性</span><span>制造解决方案。</span><span> </span></p>

<p><span lang="EN-US">ITEC</span><span>一直处于半导体生产的前沿。总经理</span><span lang="EN-US">Marcel Vugts</span><span>表示:</span><span lang="EN-US">“ITEC</span><span>扎根于</span><span>半导体制造</span><span>领域</span><span>,作为飞利浦、恩智浦和</span><span lang="EN-US">Nexperia</span><span>的合作伙伴,我们将</span><span lang="EN-US">30</span><span>多年来</span><span>的</span><span>自动化专业知识与</span><span>最</span><span>先进</span><span>的</span><span>设备结合</span><span>起来</span><span>。</span><span lang="EN-US">ITEC</span><span>致力于将最新</span><span>的</span><span>技术和制程专业知识应用到量身定制的创造性解决方案中,我们的客户群使用的行业领先工具超过了</span><span lang="EN-US">2500</span><span>个。我们能够</span><span>助力</span><span>客户在质量、生产率和可持续性方面处于领先地位,同时把总拥有成本降到最低。</span></p>

<p><span>目前,</span><span lang="EN-US">ITEC</span><span>提供以下标杆性解决方案,从而实现先进的半导体后</span><span>道</span><span>制造:</span></p>

<ul>
<li><span>适用于裸片粘接和芯片测试的</span><span lang="EN-US">ADAT</span><span>组装设备</span><span lang="EN-US">——</span><span>最快速的组装设备,每秒处理的裸片数最多达</span><span lang="EN-US">20</span><span>片</span><span>,每个系统每天生产的芯片数达</span><span lang="EN-US">150</span><span>万</span><span>片</span><span>。</span></li>
<li><span lang="EN-US">Parset</span><span>测试平台</span><span lang="EN-US">——</span><span>用于小信号器件和功率</span><span lang="EN-US">MOS</span><span>器件的电气参数测试,速度高达每小时</span><span lang="EN-US">92,000</span><span>片芯</span><span>片。</span></li>
<li><span>用于半导体前</span><span>道</span><span>和后</span><span>道</span><span>制造的智能视觉检测系统,采用深度学习技术。</span><span> </span></li>
<li><span>工厂自动化和智能制造</span><span lang="EN-US">——</span><span>完整的设备控制软件套件,将计划、优化、可追溯性和分析功能组合在一起,利用</span><span lang="EN-US">“</span><span>大数据</span><span lang="EN-US">”</span><span>分析和机器学习技术,在大批量半导体制造中实现行业领先的工业</span><span lang="EN-US">4.0</span><span>生产。</span></li>
</ul>

<p><span lang="EN-US">Vugts</span><span>总结道:</span><span lang="EN-US">“</span><span>在</span><span lang="EN-US">ITEC</span><span>的历史上,通过使用我们生产的设备,分立式半导体器件的年产量已大幅提高,从</span><span lang="EN-US">1991</span><span>年的</span><span lang="EN-US">45</span><span>亿增加到</span><span lang="EN-US">2020</span><span>年的</span><span lang="EN-US">900</span><span>多亿,这意味着</span><span lang="EN-US">ITEC</span><span>的设备平均每年为世界上的一位公民生产十个器件。</span><span>随着</span><span>当前全球芯片严重短缺</span><span>及交货期的</span><span>延长</span><span>,</span><span lang="EN-US">ITEC</span><span>现</span><span>作为</span><span>一家独立公司</span><span>,</span><span>有利于未来的发展,这</span><span>使</span><span>我们能够为行业的高速发展提供支持,并重新定义制造行业。</span><span lang="EN-US">”</span></p>

<p><strong><span>关于</span></strong><strong><span lang="EN-US">ITEC</span></strong></p>

<p><span lang="EN-US">ITEC</span><span>成立于</span><span lang="EN-US">1991</span><span>年,前身为飞利浦(后来的恩智浦及</span><span lang="EN-US">Nexperia</span><span>)的一个分支部门,致力于提供半导体、</span><span lang="EN-US">RFID</span><span>和</span><span lang="EN-US">miniLED</span><span>制造设备和系统。</span><span lang="EN-US">2021</span><span>年,</span><span lang="EN-US">ITEC</span><span>成为</span><span lang="EN-US">Nexperia</span><span>旗下的一家独立公司。</span><span lang="EN-US">ITEC</span><span>提供最高生产率水平的组装、测试、检测和智能制造平台,支持从小信号器件到功率</span><span lang="EN-US">MOS</span><span>器件的大批量制造。</span><span lang="EN-US">ITEC</span><span>总部位于荷兰奈梅亨,在香港拥有大型供应链和客户支持</span><span>办事处</span><span>。</span></p>