<p><em>优异</em><em>的开关和更高的可靠性在各种</em><em>挑战性应用中</em><em>提高</em><em>功率密度</em></p>
<p><strong>2021年</strong><strong>2</strong><strong>月</strong><strong>18</strong><strong>日</strong><span><span> </span>—推动高能效创新的安森美半导体 (ON Semiconductor,美国纳斯达克上市代号:</span><a href="http://www.onsemi.cn/PowerSolutions/ir.do"><span>ON</span></a><span>),发</span><span>布</span><a href="https://www.onsemi.cn/products/wide-bandgap/silicon-carbide-sic-mosfets…;一系列新的碳化硅</span></a><a href="https://www.onsemi.cn/products/wide-bandgap/silicon-carbide-sic-mosfets… href="https://www.onsemi.cn/products/wide-bandgap/silicon-carbide-sic-mosfets… href="https://www.onsemi.cn/products/wide-bandgap/silicon-carbide-sic-mosfets… href="https://www.onsemi.cn/products/wide-bandgap/silicon-carbide-sic-mosfets… href="https://www.onsemi.cn/products/wide-bandgap/silicon-carbide-sic-mosfets… href="https://www.onsemi.cn/products/wide-bandgap/silicon-carbide-sic-mosfets…器件</span></a><span>,</span><span>适</span><span>用于功率密度</span><span>、能</span><span>效和可靠性</span><span>攸关</span><span>的</span><span>高要求</span><span>应用。</span><span>设计人员</span><span>用新</span><span>的</span><span>SiC器件</span><span>取代</span><span>现有的硅开关技术,将在</span><a href="https://www.onsemi.cn/solution/automotive/vehicle-electrification?utm_s…;电动汽车</span></a><a href="https://www.onsemi.cn/solution/automotive/vehicle-electrification?utm_s… href="https://www.onsemi.cn/solution/automotive/vehicle-electrification?utm_s… href="https://www.onsemi.cn/solution/automotive/vehicle-electrification?utm_s…;)车载充电器</span></a><a href="https://www.onsemi.cn/solution/automotive/vehicle-electrification?utm_s… href="https://www.onsemi.cn/solution/automotive/vehicle-electrification?utm_s… href="https://www.onsemi.cn/solution/automotive/vehicle-electrification?utm_s…;、</span><a href="https://www.onsemi.cn/solution/industrial-cloud-power/energy-infrastruc…;太阳能逆变器</span></a><span>、</span><a href="https://www.onsemi.cn/solution/industrial-cloud-power/cloud-power/serve…;服务器电源</span></a><a href="https://www.onsemi.cn/solution/industrial-cloud-power/cloud-power/serve… href="https://www.onsemi.cn/solution/industrial-cloud-power/cloud-power/serve… href="https://www.onsemi.cn/solution/industrial-cloud-power/cloud-power/serve…;、</span><span>电信和</span><a href="https://www.onsemi.cn/solution/industrial-cloud-power/energy-infrastruc…;不间断电源</span></a><a href="https://www.onsemi.cn/solution/industrial-cloud-power/energy-infrastruc… href="https://www.onsemi.cn/solution/industrial-cloud-power/energy-infrastruc…;等应用中实现显</span><span>著</span><span>更好的性能</span><span>。</span></p>
<p><img alt="安森美半导体发布新的650 V碳化硅 (SiC) MOSFET" data-entity-type="file" data-entity-uuid="33c092d4-4a18-4e4a-93ab-e6dee22fa87b" height="316" src="http://new.eetrend.com/files/2021-02/wen_zhang_/100061866-122656-1.jpg&…; width="316" /></p>
<p><span>安森美半导体新</span><span>的</span><span>车</span><span>规</span><span>AECQ101和工业级</span><span>合格</span><span>的650</span><span>伏</span><span>(</span><span>V</span><span>)</span><span><span> </span></span><span>SiC MO</span><span>SFET基于</span><span>一种</span><span>新</span><span>的</span><span>宽</span><span>禁</span><span>带</span><span>材料,提供</span><span>比硅更胜一筹</span><span>的开关性能和</span><span>更好</span><span>的</span><span>热性能</span><span>,</span><span>因而</span><span>提高系统级</span><span>能</span><span>效</span><span>、</span><span>功率密度,</span><span>及</span><span>减</span><span>小</span><span>电磁干扰</span><span>(</span><span>EMI</span><span>)、</span><span>系统尺寸和重量。</span></p>
<p><span>新一代SiC MOSFET采用</span><span>新</span><span>颖</span><span>的有源单元设计,结合先进的薄晶圆技术,可在650 V击穿电压实现同类最佳的品质因数Rsp</span><span><span> </span></span><span>(</span><span>Rdson * area</span><span>)</span><span>。NVBG015N065SC1</span><span>、</span><span>NTBG015N065SC1</span><span>、</span><span>NVH4L015N065SC1和NTH4L015N065SC1</span><span>采用D2PAK7L和To247封装</span><span>,</span><span>具有</span><span>市场</span><span>最低的Rdson</span><span><span> </span></span><span>(</span><span>12 mOhm</span><span>)</span><span>。<span> </span></span><span>这</span><span>技术</span><span>还优化</span><span>能量损失</span><span>品质因数</span><span>,从而优化了汽车和工业应用中的性能。 内</span><span>置门</span><span>极电阻</span><span><span> </span>(</span><span>Rg</span><span>)</span><span>为设计人员提供</span><span>更大的灵活性,而无需使用外部</span><span>门</span><span>极电阻人为</span><span>地降低</span><span>器件</span><span>的</span><span>速</span><span>度</span><span>。 更高的浪涌</span><span>、</span><span>雪崩能力和短路鲁棒性</span><span>都</span><span>有助于增强</span><span>耐用</span><span>性,从而提供更高的可靠性和更长的器件</span><span>使用</span><span>寿命。</span></p>
<p><span>安森美半导体</span><span>先进</span><span>电源</span><span>分</span><span>部</span><span>高级副总裁Asif Jakwani</span><span>在发布新品时</span><span>说</span><span>:“</span><span>在现代电源应用中,</span><span>如电动汽车</span><span>(</span><span>EV)车载充电器</span><span>(</span><span>OBC</span><span>)和</span><span>可再生能源</span><span>、</span><span>企业计算</span><span>及</span><span>电信</span><span>等</span><span>其他应用</span><span>,<span> </span></span><span>高能</span><span>效</span><span>、</span><span>可靠性和功率密度是设计人员</span><span>一直</span><span>面临的挑战。</span><span>这些新的SiC MOSFET比同等的硅开关技术显</span><span>著</span><span>提高</span><span>性能,使工程师能够满足这些具有挑战性的设计目标。 增强</span><span>的性能降低损耗,从而提高</span><span>能</span><span>效,减少热管理需求,并降低</span><span>电磁干扰(</span><span>EMI</span><span>)</span><span>。使用这些新</span><span>的</span><span>SiC MOSFET</span><span>的</span><span>最终</span><span>结果是</span><span>更小</span><span>、</span><span>更轻</span><span>、</span><span>更高效和更可靠的电源方案。”</span></p>
<p><span>新器件</span><span>均为</span><span>表面贴装,并</span><span>提供</span><span>行业标准封装类型,</span><span>包括TO247和D2PAK。</span></p>
<p><strong>更多资源及文档:</strong></p>
<p><span>登陆页:</span><a href="https://www.onsemi.cn/solutions-applications/segments/industrial-cloud-…;宽禁带方案</span></a></p>
<p><span>产品页:</span><a href="https://www.onsemi.cn/products/wide-bandgap/silicon-carbide-sic-mosfets… V SiC MOSFET</span></a></p>
<p><strong>关于安森美半导体</strong><br />
<span>安森美半导体</span><span>(ON Semiconductor</span><span>,美国纳斯达克上市代号:</span><a href="http://www.onsemi.cn/PowerSolutions/ir.do"><span>ON</span></a><span>)</span><span>致力于推动高能效电子的创新,使客户能够减少全球的能源使用。安森美半导体领先于供应基于半导体的方案,提供全面的高能效电源管理、模拟、传感器、逻辑、时序、互通互联、分立、系统单芯片</span><span>(SoC)</span><span>及定制器件阵容。公司的产品帮助工程师解决他们在</span><a href="http://www.onsemi.cn/PowerSolutions/content.do?id=15067"><span>汽车、通信、计算机、消费电子、工业、医疗、航空及国防应用</span></a><span>的独特设计挑战。公司运营敏锐、可靠、世界一流的供应链及品质项目,一套强有力的守法和道德规范计划,及在北美、欧洲和亚太地区之关键市场运营包括制造厂、销售办事处及设计中心在内的业务网络。更多信息请访问</span><a href="http://www.onsemi.cn/"><span>http://www.onsemi.cn</span></a><span>。</span></p>