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Credo推出3.2Tbps XSR 单通道112Gbps高速连接Chiplet

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<p><em>该产品是采用Credo</em><em>低功耗混合</em><em>信号</em><em>DSP</em><em>先进技术的</em><em><span>&nbsp;</span>32x112G 全双工Chiplet</em><em>，</em></p>

<p><em>适用于：采用</em><em>高性能</em><em>、</em><em>低功耗</em><em>的</em><em>MCM ASIC</em><em>解决方案的先进</em><em>交换</em><em>机</em><em>、</em><em>高性能</em><em>计算、人工智能</em><em>（A</em><em>I</em><em>）</em><em>、机器学习</em><em><span>&nbsp;</span></em><em>(ML)和下一代</em><em>光电合封（</em><em>CPO</em><em>）等多种应用场景</em></p>

<p><strong>2021年5月19日</strong><span><span>&nbsp;</span>–<span>&nbsp;</span></span><span>专注为</span><span>&nbsp;800G/400G/200G/100G</span><span>高速端口</span><span>网络</span><span>提供</span><span>高性能、低功耗先进连接解决方案的全球创新领导者</span><a href="https://www.credosemi.com/"><strong>Credo</strong></a><span>,<span>&nbs…;——</span><span>业内首款3.2Tbps XSR<span>&nbsp;</span></span><span>低功耗，单通道速率为</span><span>112Gbps</span><span>的高速连接</span><span>Chiplet。为适应下一代</span><span>MCM (多芯片</span><span>组件</span><span>)<span>&nbsp;</span></span><span>A</span><span>S</span><span>I</span><span>C</span><span>的应用需求，</span><span>该产品</span><span>在</span><span>功耗</span><span>及</span><span>连接距离性能</span><span>上进行了深度优化</span><span>，</span><span>可用于高速交换机、高性能计算、人工智能（</span><span>AI</span><span>）、机器学习</span><span><span>&nbsp;</span>(ML)</span><span>和光电合封（</span><span>CPO</span><span>）等多种场景。</span></p>

<p><a href="https://www.credosemi.com/serdes-ip-and-chiplets"><strong>Nutcracker</s… XSR SerDes<span>&nbsp;</span></span><span>通道</span><span>,<span>&nbsp;</span></span><span>用于与片上系统（</span><span>SOC</span><span>）的主</span><span>ASIC通信。</span><span>Line</span><span>端</span><span>有</span><span>32 条</span><span>采用</span><span>DSP</span><span>优化技术的</span><span>低功耗112G MR+</span><span>通道</span><span>,<span>&nbsp;</span></span><span>用于提供向外通信的</span><span>接口。</span></p>

<p><span>Credo</span><span>独特的</span><span>DSP</span><span>技术使其能够在保证低功耗的前提下，采用</span><span>TSMC 12nm</span><span>成熟工艺</span><span>制程</span><span>来开发生产这款</span><span>32x112Gbps XSR<span>&nbsp;</span></span><span>&lt;—&gt;</span><span><span>&nbsp;</span>32x112Gbps MR+ Retimer<span>&nbsp;</span></span><span>裸片</span><span>。相比之下,<span>&nbsp;</span></span><span>其他替代</span><span>解决方案</span><span>则将需要使用更为昂贵的</span><span>7nm 或5nm工艺</span><span>节点</span><span>。</span></p>

<p><span>经</span><span>Credo</span><span>优化设计的芯片架构，使</span><span>SOC ASIC</span><span>供应商能够通过使用面积节省和功耗较低的</span><span>XSR</span><span>接口，最大限度发挥其核心处理功能。</span><span>Nutcracker</span><span>可</span><span>为 MCM 提供强大的封装外部接口，</span><span>以</span><span>便于</span><span>其</span><span>集成在各种系统级配置中。</span></p>

<p><span>在MCM设计中</span><span>使用C</span><span>hiplet</span><span>可以</span><span>加速ASIC</span><span>的发展与创新</span><span>，</span><span>能够更快</span><span>满足交换</span><span>机</span><span>、存储、服务供应商、高性能计算、人工智能和机器学习</span><span>等多种应用场景下</span><span>不断增长的性能需求。</span></p>

<p><span>“</span><span>我们与</span><span>全球财富</span><span>200</span><span>强</span><span>的大客户进行战略合作，研发并实现了Nutcracker的商业化，” Credo商务</span><span>拓展</span><span>副总裁Jeff Twombly表示。“下一代ASIC部署</span><span>需要</span><span>采用异构MCM</span><span>来满足</span><span>所有技术行业</span><span>对性能方面不断增长的</span><span>要求</span><span>，这其中也</span><span>包括数据中心新兴的</span><span>光电合封（C</span><span>PO</span><span>）</span><span>技术。Nutcracker是</span><span>当下能够满足这些需求的先进的解决方案。</span><span>” Twombly继续说道。</span></p>

<p><span>650 Group创始人兼技术分析师Alan Weckel表示</span><span>：</span><span>“</span><span>Credo的Nutcracker XSR Chiplet是下一代ASIC设计的重要组成部分。随着数据中心市场向400G、800G及更高速的ASIC发展，市场将从单芯片ASIC过渡到MCM解决方案</span><span>。此外，</span><span>随着市场朝25.6Tbps、51.2Tbps迈进，我们预期</span><span>将会有</span><span>更多ASIC</span><span>采用M</span><span>CM</span><span>结构</span><span>。”</span></p>

<p><span>Nutcracker将在2021 TSMC<span>&nbsp;</span></span><span>线上创新平台中</span><span>进行展示。活动后，展演视频将在Credo官网发布</span><span>。</span><span>目前，Nutcracker已投入</span><span>量产</span><span>。</span></p>

<p><span>更多有关Nutcracker芯片和其他行业领先的Credo连接解决方案信息，请访问：</span></p>

<p><a href="https://www.credosemi.com/serdes-ip-and-chiplets"><strong>https://www.c…;

<p><strong>关于Credo</strong></p>

<p><span>Credo Technology 成立于2008年，是全球领先的高性能串行连接解决方案供应商，在上海、硅谷、香港、新竹</span><span>、</span><span>武汉</span><span>和南京</span><span>设有分支机构。Credo多年来致力于为互联网、云计算、大数据、5G、人工智能等领域提供低成本、低功耗、最先进的超高速单通道112G/56G/28G连接商业解决方案。Credo凭借多年的技术积累，成为全球屈指可数能在28nm/16nm/12nm/7nm全部工艺基础上实现400G/800G连接商业解决方案的公司，产品满足客户对成本、功耗、性能、上市时间、产能等多方位要求。</span></p>

<p><span>更多信息，请访问：</span><a href="https://www.credosemi.com/"><strong>https://www.credosemi.com</strong><…;。</span><span>或</span><span>在</span><a href="https://www.linkedin.com/company/credo-semiconductor/"><strong>LinkedIn… href="https://twitter.com/credosemi"><strong>Twitter</strong></a><span>关注Cred…;。</span></p>