<p><span><span>横跨多重电子应用领域的全球领先的半导体供应商</span></span><span><strong>意法半导体</strong></span><span><span>(STMicroelectronics,</span></span><span><span>简称</span></span><span><span>ST；</span></span><span><span>纽约证券交易所代码</span></span><span><span>:STM)</span></span><span>将通过参与</span><span>高通</span><span>Qualcomm</span><span>®</span><span>Platform</span><span>平台解决方案生态系统</span><span>计划</span><span>，</span><span>采用</span><span>高通</span><span>科技（</span><span>Qualcomm Technologies, Inc</span><span>）的技术</span><span>开发创新</span><span>的</span><span>软件解决方案</span><span>。此次合作将进一步</span><span>扩</span><span>大意法半导体</span><span>传感器技术的领先地位。</span></p>
<p><span>在</span><span>该</span><span>计划中，意法半导体为OEM</span><span>厂商</span><span>提供</span><span>经过</span><span>预验证的MEMS和其他传感</span><span>器</span><span>软件，</span><span>为</span><span>下一代智能手机</span><span>、</span><span>互联</span><span>PC</span><span>、</span><span>物联网</span><span>和穿戴设备</span><span>提供先进的</span><span>功能。</span><span>近期，</span><span>高通</span><span>科技已在其</span><span>最新的先进5G移动参考平台</span><span>内</span><span>预选</span><span>了</span><span>意法半导体最新的高</span><span>精度、</span><span>低功耗</span><span>、带</span><span>智能传感器软件</span><span>的</span><span>运动跟踪IC</span><span>，</span><span>以及意法半导体</span><span>精确度最高</span><span>的压力传感器。</span></p>
<p><span>新的运动跟踪传感器 iNEMO LSM6DST是</span><span>一款</span><span>6轴惯性测量单元（IMU），</span><span>在一个</span><span>紧凑高效的系统级封装</span><span>内集成一个</span><span>3轴数字加速度计和</span><span>一个</span><span>3轴陀螺仪</span><span>。</span><span>LSM6DST</span><span>的功耗处于</span><span>业界最低</span><span>水平，在</span><span>高性能模式下为0.55mA，</span><span>在</span><span>仅加速度计模式下</span><span>只有</span><span>4µA</span><span>，可以实现功耗极低的全时</span><span>开启高准确度运动跟踪</span><span>功能</span><span>。LPS22HH</span><span>是意法半导体的</span><span>业界首款</span><span>有</span><span>I3C</span><span>总线</span><span>的低噪声(0.65Pa)</span><span>、</span><span>高准确度(±0.5hPa)压力传感器</span><span>，</span><span>LSM6DST</span><span>搭配</span><span>LPS22HH可提高准确度的位置跟踪</span><span>功能</span><span>，同时满足最严格的功率预算</span><span>限制</span><span>。</span></p>
<p><span>对于成像应用，</span><span>LSM6DST</span><span>完全支持</span><span>EIS</span><span>和</span><span>OIS</span><span>（电子和光学</span><span>图像防抖</span><span>）应用，因为该模块包括</span><span>专用的</span><span>可配置</span><span>的</span><span>OIS</span><span>和辅助</span><span>SPI</span><span>信号处理路径，</span><span>可配置</span><span>陀螺仪和加速度计</span><span>信号路径</span><span>，</span><span>反过来，</span><span>辅助</span><span>SPI<span> </span></span><span>和主接口</span><span>(SPI / I²C & MIPI I3CSM)</span><span>可以配置</span><span>OIS</span><span>。</span></p>
<p><span>得益于</span><span>意法半导体稳健、</span><span>成熟的低功耗</span><span>ThELMA</span><a href="https://exmail.qq.com/cgi-bin/viewdocument?sid=3VSl3z26PfBcDyd4,2&f…;工艺技术，</span><span>LSM6DST</span><span>可以</span><span>支持并简化低功耗电路设计，</span><span>并提供</span><span>连接</span><span>传感</span><span>器和</span><span>应用</span><span>处理器</span><span>的</span><span>I²C</span><span>、</span><span>MIPII3C®</span><span>或</span><span>SPI</span><span>接口</span><span>。</span><span>在这个惯性单元中，</span><span><span> </span>9 KB</span><span><span> </span></span><span>FIFO</span><span>存储器支持</span><span>动态数据批处理</span><span>，</span><span>16</span><span>个有限状态机可以识别来自传感器的</span><span>可编程的</span><span>数据序列，并进一步降低系统级功耗</span><span>。</span></p>
<p><span><span>高通科技</span></span><span><span>产品管理</span></span><span><span>部</span></span><span><span>副总裁</span></span><span><span>Manvinder Singh</span></span><span><span>表示：</span></span><span><span>“</span></span><span><span><span> </span>ST</span></span><span><span>早就认识到传感器在高通</span></span><span><span>科技</span></span><span><span>解决方案中的重要性，并且多年来一直是</span></span><span><span>我们的重要</span></span><span><span>合作</span></span><span><span>伙伴</span></span><span><span>。</span></span><span><span>S</span></span><span><span>T</span></span><span><span>在新接口（例如</span></span><span><span>MIPI I3C</span></span><span><span>）传感器方面</span></span><span><span>走在市场最前列</span></span><span><span>，在维持或提高传感器准确度的同时</span></span><span><span>也有效降低了产品</span></span><span><span>的功率预算。我们很高兴</span></span><span><span>ST</span></span><span><span>能够加入</span></span><span><span>高通平</span></span><span><span>台解决方案生态系统计划，在我们的</span></span><span><span>Qualcomm</span></span><span><span>®</span></span><span><span>Snapdragon™</span></span><span><span>移动平台的</span></span><span><span>全时开启（</span></span><span><span>always-on</span></span><span><span>）</span></span><span><span>低功耗</span></span><span><span>模块</span></span><span><span>上集成</span></span><span><span>并</span></span><span><span>优化其先进的传感器算法。与</span></span><span><span>ST</span></span><span><span>等战略供应商的合作对于</span></span><span><span>加快</span></span><span><span>5G</span></span><span><span>技术在不同垂直</span></span><span><span>市场的应用</span></span><span><span>至关重要。”</span></span></p>
<p><span>意法半导体模拟、</span><span>MEMS</span><span>及传感器产品部副总裁、</span><span>MEMS</span><span>传感器事业部总经理</span><span>Andrea Onetti</span><span>表示：“与高通科技紧密合作多年，我们能够保证传感器性能满足下一代移动设备、可穿戴设备以及支持</span><em>Qualcomm</em><em>®</em><em><span> </span>Sensor Execution Environment</em><span>环境的软件解决方案的苛刻要求，其中包括先进功能，例如，智能手机和移动</span><span>PC</span><span>的铰链或折叠角检测，并让这些功能无缝集成，更快上市，满足全球客户的需求。业界</span><span>功耗</span><span>最低的高准确度</span><span>IMU</span><span>配合</span><span>高准确度</span><span>、可靠的</span><span>时</span><span>漂温漂均极其</span><span>低的</span><span>压</span><span>力传感器，可</span><span>达到目前能满足</span><span>e911</span><span>和</span><span>eCall</span><span>要求的</span><span>最</span><span>高</span><span>定位准确度。”</span></p>
<p><span><span>[1]</span></span><span><span> </span>ThELMA</span><span>（</span><span>微陀螺仪和加速度计厚外延层</span><span>）</span><span>是</span><span>意法半导体</span><span>专有的表面微加工工艺，</span><span>整合薄厚</span><span>可变的多晶硅层</span><span>制造感测</span><span>结构和互连</span><span>线</span><span>，</span><span>使</span><span>加速度计和陀螺仪的机械</span><span>单元能够</span><span>集成</span><span>在一个</span><span>芯片</span><span>上</span><span>。</span></p>