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英飞凌OptiMOS™ TOLx系列推出全新封装:TOLG封装可强化TCoB耐用性,TOLT封装提供优异散热性能

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<p><span>近日,</span><span>电动摩托车、电动叉车与其他轻型电动车(</span><span>LEV</span><span>)以及电动手工具和电池管理系统等应用皆需要高额定电流、坚固耐用与更长的使用寿命等要求。英飞凌科技股份有限公司</span><span><span>&nbsp;</span>(FSE</span><span>:</span><span>IFX/OTCQX</span><span>:</span><span>IFNNY</span><span>)通过为电源系统设计人员提供更多选择,以符合其不同的设计需求,并在最小空间内展现最高性能。英飞凌借助创新的</span><span>TO-Leadless</span><span>(</span><span>TOLL</span><span>)封装,在</span><span>OptiMOS™</span><span>功率</span><span>MOSFET TOLx</span><span>系列推出两款新封装:</span><span>TOLG</span><span>(配备鸥翼型导线的</span><span>TO</span><span>导线)以及</span><span><span>&nbsp;</span>TOLT</span><span>(</span><span>TO</span><span>导线顶部散热)。</span><span>TOLx</span><span>系列皆具备极低的</span><span>R&nbsp;</span><span>DS(on)</span><span>&nbsp;</span><span>与超过</span><span>300 A</span><span>的高额定电流,可提升高功率密度设计的系统效率。</span></p>

<p><span>TOLG</span><span>封装结合了</span><span>TOLL</span><span>与</span><span>D&nbsp;</span><span>2</span><span>PAK 7</span><span>针脚封装的最佳功能,与</span><span>TOLL</span><span>共用相同的</span><span>10 x 11</span><span><span>&nbsp;</span></span><span>mm&nbsp;</span><span>2</span><span>基底面与电气性能,并增加了与</span><span>D&nbsp;</span><span>2</span><span>PAK 7</span><span>针脚相容的弹性。</span><span>TOLG</span><span>的主要优势在採用铝绝缘金属基板(</span><span>Al-IMS</span><span>)的设计时特别明显。在这些设计中,热扩张係数(</span><span>CTE</span><span>)说明材料在温度变化时的形状变化趋势,比铜</span><span>IMS</span><span>和</span><span>FR4</span><span>电路板更高。</span></p>

<p><span>随著时间流逝,电路板上的温度循环(</span><span>TCoB</span><span>)会造成封装和</span><span>PCB</span><span>之间的焊接点出现裂缝。通过鸥翼型导线的灵活性,</span><span>TOLG</span><span>展现出色的焊接点耐用性,在反覆发生温度循环的应用中大幅增加了产品的可靠性。与</span><span>IPC-9701</span><span>标准要求相比,全新封装能够展现两倍的</span><span>TCoB</span><span>性能。</span></p>

<p><span>TOLT</span><span>封装针对优异的热性能进行优化。此封装在结构方面采用上下翻转的导线,将裸露的金属置于顶端,且每一面都有多条鸥翼型导线,可提供高电流承载的漏极与源极连接。在导线上下翻转的框架中,热量会从裸露的金属顶端穿过绝缘材料,直接传到散热片。与</span><span>TOLL</span><span>底部冷却封装相比,</span><span>TOLT</span><span>的</span><span>&nbsp;R&nbsp;</span><span>thJA</span><span>改善了</span><span>20%</span><span>,</span><span>R&nbsp;</span><span>thJC</span><span>则改善了</span><span>50%</span><span>。这些规格可降低系统物料成本,特别是散热片。此外,由于现在可将组件安装在</span><span>MOSFET</span><span>的底部,因此采用</span><span>TOLT</span><span>封装的</span><span>OptiMOS</span><span>能够减少</span><span>PCB</span><span>空间。</span></p>

<p><strong>供货情况</strong></p>

<p><span>OptiMOS TOLx<span>&nbsp;</span></span><span>系列的</span><span>OptiMOS 3<span>&nbsp;</span></span><span>与</span><span><span>&nbsp;</span>5<span>&nbsp;</span></span><span>技术将推出各种电压等级的产品。</span><span>TOLG<span>&nbsp;</span></span><span>将于</span><span>2021<span>&nbsp;</span></span><span>年第四季提供</span><span><span>&nbsp;</span>60 V<span>&nbsp;</span></span><span>至</span><span><span>&nbsp;</span>250 V<span>&nbsp;</span></span><span>的广泛产品组合,包括同级最佳和最佳价格性能比的产品。</span><span>TOLT<span>&nbsp;</span></span><span>目前提供</span><span><span>&nbsp;</span>80 V<span>&nbsp;</span></span><span>和</span><span><span>&nbsp;</span>100 V<span>&nbsp;</span></span><span>电压等级的产品。此外,还提供评估电源板,并採用</span><span><span>&nbsp;</span>TOLG<span>&nbsp;</span></span><span>封装的</span><span><span>&nbsp;</span>100 V OptiMOS 5<span>&nbsp;</span></span><span>功率</span><span><span>&nbsp;</span>MOSFET</span><span>(</span><span>IPTG014N10M5</span><span>)。详细资讯请浏览</span><span><span>&nbsp;</span></span><a href="http://www.infineon.com/tolx"><span>www.infineon.com/tolx</span></a><sp…;。</span></p>

<p><span>本产品将于</span><span><span>&nbsp;</span>6</span><span>月</span><span>14</span><span>日至</span><span>17<span>&nbsp;</span></span><span>日在</span><span>2021</span><span>年应用电子电力大会(</span><span>APEC</span><span>)的英飞凌展示平台上展出。有关英飞凌参加</span><span><span>&nbsp;</span>2021 APEC<span>&nbsp;</span></span><span>大会的详细资讯,请浏览</span><span><span>&nbsp;</span></span><a><span>www.infineon.com/APEC</span></a><span&gt;。</span></p>

<p><strong>关于英飞凌</strong></p>

<p><span>英飞凌科技股份公司是全球领先的半导体科技公司,我们让人们的生活更加便利、安全和环保。英飞凌的微电子产品和解决方案将带您通往美好的未来。</span><span>2020</span><span>财年(截止</span><span>9</span><span>月</span><span>30</span><span>日</span><span>)</span><span>,公司的销售额达</span><span>85</span><span>亿欧元,在全球范围内拥有约</span><span>46,700</span><span>名员工。</span><span>2020</span><span>年</span><span>4</span><span>月,英飞凌正式完成了对赛普拉斯半导体公司的收购,成功跻身全球十大半导体制造商之一。</span></p>

<p><span>英飞凌在法兰克福证券交易所(股票代码:</span><span>IFX</span><span>)和美国柜台交易市场<span>&nbsp;</span></span><span>OTCQX International Premier</span><span>(股票代码:</span><span>IFNNY</span><span>)挂牌上市。更多信息,请访问</span><a href="http://www.infineon.com/"><span>www.infineon.com</span></a></p&gt;

<p><span>更多新闻,请登录</span><span>英飞凌</span><span>新闻中心:</span><a href="https://www.infineon.com/cms/cn/about-infineon/press/press-releases/"><…;

<p><strong>英飞凌中国</strong></p>

<p><span>英飞凌科技股份公司于</span><span>1995</span><span>年正式进入中国</span><span>大陆</span><span>市场。自</span><span>1995</span><span>年</span><span>10</span><span>月在无锡建立第一家企业以来,英飞凌的业务取得非常迅速的增长,在中国拥有约</span><span>2000</span><span>名员工,已经成为英飞凌全球业务发展的重要推动力。英飞凌在中国建立了涵盖研发、生产、销售、市场、技术支持等在内的完整的产业链,并在销售、技术研发、人才培养等方面与国内领先的企业、高等院校开展了深入的合作。</span></p>